Thin Small Outline Package

Thin small-outline packages, or TSOPs are a type of surface mount IC package. They are notably very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. However, they are being supplanted by ball grid array packages which can achieve even higher densities.

Any questions please call us (949) 276-5225 or email us rfq@4starelectronics.com