SMT Version of TO-220

About SMT Version of TO-220

The TO-220 package is a known industry standard. The package includes a thermally conductive base which is preferably metal and on which a semiconductor device is mounted with low thermal impedance between the device and the base. The device may also be electrically connected to the base. The semiconductor device and a portion of the frame are typically encapsulated by a resin material which protects the device from its environment. A locking projection typically extends from the base to the outside of the protective epoxy and is fastened to the external mounting surface to draw heat from the device. Also included are lead terminals which extend outside the resin body and include bonding pads to which a wire bond connection is provided from the device to the leads.

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