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Home > Package Types > Low-profile Quad Flat Pack
Low-profile Quad Flat Pack
Low Profile Quad Flat Pack (LQFP) packages provide the same benefit of the metric QFP packages, but are thinner (body thickness of 1.4mm) and have a standard lead-frame footprint (2.0mm lead footprint). LQFPs help to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 256. Body sizes range from 5 x 5mm to 28 x 28mm. Copper lead-frames are used for the LQFP package. Lead pitches available for LQFP package are 0.65mm, 0.5mm, 0.4mm and 0.3mm.
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