Land Grid Array

Land-grid array (LGA) is an integrated circuit (IC) package type for surface mount technology (SMT). Instead of pins, LGA uses pads of bare, gold-plated copper pads that touch pins on the motherboard. Compared to other IC package types, LGA provides larger contact points that allow for higher clock frequencies. LGA also provides for higher densities that allow for a more stable power supply to the chip. Fine-pitch land-grid array (FLGA) is an extremely compact and lightweight version of LGA which is suitable for miniature disc drives and digital cameras. Other variants of land-grid array (LGA) are also available.

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