Package Types

At 4 Star Electronics we stock obsolete electronic components from over 675 manufacturers. Below is the list of the package types we have in-stock. Here we provide detailed information about the package types we stock . Browse our inventory by package type to find the electronic components you need to keep your production running smoothly. Once you determine the specific package you are looking for use our global part search utlity to check stock and submit a request for quote (RFQ).

Main Package Types

BGA - Ball Grid Array
BQFP - Bumped Quad Flat Pack
CBGA - Ceramic Ball Grid Array
CDIP - Ceramic Dual Inline Package
CFP - Ceramic Flat Package
CQFP - Ceramic Quad Flat Pack
CZIP - Ceramic Zig Zag Package
CC - Chip Capacitors
CRN - Chip Resistor Networks
CR - Chip Resistors
CSP - Chip Scale Package
DIMM - Dual Inline Memory Module
DIP - Dual Inline Package
DIP - Dual Inline Package
LGA - Land Grid Array

LCCC - Leadless Ceramic Chip Carrier
LCC - Leadless Chip Carrier
Radial - Leads on the Radius
Axial - Leads Through Center Axis
LQFP - Low-profile Quad Flat Pack
MELF - Metal Electrode Face
MCM - Multi-Chip Module
PGA - Pin Grid Array
PLCC - Plastic Leaded Chip Carrier
PQFP - Plastic Quad Flat Pack
PSSOP - Plastic Small Outline Package
QFP - Quad Flat Pack
QVSOP - Quality Very Small Outline Package
QSOP - Quarter Size Outline
SQFP - Shrink Quad Flat Pack

SSO - Shrink Small Outline
SSOP - Shrink Small Outline Package
SIMM - Single Inline Memory Module
SIP - Single Inline Package
SOIC - Small Outline Integrated Circuit
SOJ - Small Outline J-Lead
SOP - Small Outline Package
SORP - Small Outline Resistor Package
SOT - Small Outline Transistors
DPAK - SMT Version of TO-220
TQFP - Thin Quad Flat Pack
TSOP - Thin Small Outline Package
TVSOP - Thin Very Small Outline Package
VFBGA - Very Fine-Pitch Ball Grid Array
VSO - Very Small Outline

Any questions please call us (949) 276-5225 or email us rfq@4starelectronics.com