Dual Inline Package

In microelectronics, a dual in-line package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins, protruding from the longer sides of the package and bent downward. A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14.

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