Chip Scale Package

A chip scale package (CSP) (sometimes, chip-scale package with a hyphen) is a type of integrated circuit chip carrier. Originally, CSP was the acronym for Chip Size Packaging. As only a few packages are chip size, the meaning of the acronym was adapted to Chip Scale Packaging. According to IPC’s standard J-STD-012, "Implementation of Flip Chip and Chip Scale Technology", in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is that their ball pitch should be no more than 1 mm.

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