Ball Grid Array

About Ball Grid Arrays

Ball-grid array (BGA) is an integrated circuit (IC) package type that places output pins in a solder-ball matrix. BGA traces are fabricated on polyimide-based films, or on laminated substrates such as bismaleimide triazine (BT). As a rule, BGA traces are designed to minimize crosstalk and potential problems with line speed. Ball-grid array (BGA) packages are also designed to meet the electrical and thermal demands of high-speed and high-power Ics. BGA provides lower ground or power inductance by assigning ground or power nets via a shorter current path to the printed circuit board (PCB). Thermally-enhanced mechanisms (e.g., heat sinks, thermal balls) may be applied to BGA packages to reduce thermal resistance.

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